Rene Mark's Blog: Elegance and talent hi-tech: Small-scale and the membrane is the developing direction of the electronic devices and components of chip type :TG.YnotDo Articles

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Article by Keith Farren

Elegance and talent hi-tech: Small-scale and the membrane is the developing direction of the electronic devices and components of chip type – Technology

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The thick diaphragm-type safety fuse is a kind of light and thin and small new component, are suitable for being compact, all kinds of electronic products of volume minification. The application is very broad, have already used in trades such as communicating device, computer and perimeter, audio-visual equipment, supply convertor, personal electronic product of digital type,etc. in a large amount. At present, the application of the thick diaphragm-type safety fuse is being still expanded constantly, the field that can be predicted, for instance: The ATM machines of the finance and commerce, tax control machine, top-end computer, POS machine, cash registering machine, move the scanning machine, recognizer of the code, all kinds of vehicle carried electric apparatus, medical instrument and equipment, accurate instrument, control box, electronic toy and electric motor vehicle control box of the commercial installation or household electrical appliance,etc..

New and high technology Limited Company of the elegance and talent in Guangdong (hereafter referred to as elegance and talent hi-tech) The thick diaphragm-type safety fuse developed, studying through matching the metal composition of some key blowout laminated layer sizing agent of the safety fuse, control the blowout characteristic of different products effectively, the products reach too unleadedly to have halogenic requirement for environment protection. The protective requirement of full circuit of the products, it is good to protect the function, accord with and employ resisting the surging characteristic and requirement for the current carrying capacity to the safety fuse of circuit at the same time. The fuse-link metallic material that the thick diaphragm-type safety fuse uses has more stable metal characteristics, the fuse-link sizing agent compactness is good, the attenuation coefficient of the pulse is small, reliability is high.

The traditional safety fuse produces 17 processes, compare the thick diaphragm-type safety fuse of traditional technology and form fuse-link metal layer and protective layer with thick film technology, the structure is reliable, the course is simple, shorten process for preparing, low cost effectively. In addition, choose to have better electric conductivity and difficult to oxidize or Ag that oxide characteristic is similar to metal characteristic of the simple substance, Ag/Pd alloy material utilized and matched the difference of melting points of material as the main metallic material of laminated layer of blowout, adjust metal composition and proportion of the sizing agent, cooperate with the graphic design of the fuse-link, can realize various blowout characteristics, guarantee the properties of product are steady at the same time. The thick diaphragm-type safety fuse adopts the method carving groove of continuous scanning of laser, form the snakelike fuse-link, figur e conformance is good, minimum can obtain 0.01mm width, the products have wider blowout characteristic indexes. Show in the picture for the comparison of adopting products and like product that the thick diaphragm-type fuse technology of elegance and talent hi-tech produces.

Compared from the electron microscope picture with and can be seen, the high-tech product blowout laminated layer compactness of elegance and talent is better, the safety fuse has better blowout characteristics. Electronic devices and components trade are towards high frequency, chip type, micromation, it is slim it take, low power consumption, response speed fast, high-resolution, heavy-duty and developing at multi-function, modularization and direction such as being intelligent, entering the components and parts era of new generation taking new electronic devices and components as body. Safety and green of the products will become important factors of influencing electronic devices and components development prospect.

Elegance and talent hi-tech is established through to the trade rival’s SWOT analysis ” Devoted to the related supplier of basic products integration of electronic messaging who is world first-class ” Development willing scene,with ” Lead in the development of science and technology, people first ” It is enterprise’s aim, launch front technology and craft of the new electronic devices and components with most advanced domain continuously, grasp it from the raw material, key key technology to a series of intact independent intellectual property right of the non utility electric installation. The company regards three national-level research and development centres, enterprise academies and national-level post-doctor’s scientific research work stations as the backing, rely on domestic and foreign institution of higher learning and scientific research institution, has set up multi-level, all-round technological innovation system. The research institute of elegance and talent has first-class experiment, analysis, detection and pilot scale to equip. According to researching and developing the demand, set up 7 key laboratories, is mainly engaged in medium and long-term project research and great technology, key technological research and development. Son (divide) Company second studies and employs the centre to be market-oriented directly, is engaged in the development of the new product and improvement of existing products. The innovative group of the workshop solves cost and quality problem especially. In order to guarantee company’s constant technological innovation ability, invest and sell the funds amounting to 5% to use for scientific research and development every year every year in elegance and talent hi-tech. From 2006 to 2009 to invest the research expenditure to reach 408,750,000 yuan totally. By the end of 2009, 207 applications for patent altogether companies, among them the patent for inv ention accounts for 60.9%. The technical advantage lets elegance and talent hi-tech dissolve the influence of the financial crisis effectively, have established the leading position of the products.

Material and key equipment backwardness in the electronic devices and components industry chain are key bottlenecks which restricts the electronic devices and components of our country and development of information industry. Advance new material and new technological production domesticization in an all-round way, can further shorten with the advanced lateral disparity in the world, promote the competitiveness of domestic electronic devices and components enterprises in an all-round way. Elegance and talent hi-tech thinks except some new technology and market of application, the development of the electronic industry of future will take practicality and low price as the core, new developing markets such as 3G, LED, e-book, intellectual mobile phone, Internet of things,etc. will become the new focus. Applications such as industry electron, car electron, IT, consumption electron, mobile phone and network communication,etc. pay attention to low power consumption, low cost to design further. Electronic devices and components trade should follow the technical development of terminal products of electron closely, pay attention to technical upgrading, miniaturization and membrane. The global electronic manufacturing industry shifts to China’s Mainland progressively, China’s Mainland will become one of the areas of components and parts demand maximum of the global chip type.

The 75th CEF convention and exhibition will be held 2009 in the same term ” The electronic messaging Award for Secinece and Technology of Chinese institute of electronics ” Award-giving meeting,develop at the elegance and talent new and high technology Co., Ltd. Guangdong safety fuses diaphragm-types thick win on the 2009 ” The electronic messaging Award for Secinece and Technology of Chinese institute of electronics ” Third-class award, show relevant product in award-winning exhibition area.

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Keith Farren

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